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Plating technology that achieves stability in quality and high reliability.
It is possible to coat entangled precision springs with high accuracy. We have successfully scaled up the processing of products that are prone to entanglement and can only be processed in small quantities.
Ueda Plating's proposal.
Proposal case for single-sided Au plating for IC/SIM card FPC.
Enhance secondary implementability with solder!
By providing a Pd plating layer as a barrier layer in between, the exposure of Ni to the Au surface can be more effectively controlled. Additionally, by incorporating a Pd layer, the Au plating can be made thinner, which enhances the secondary mounting capability with solder. This addresses the disadvantages of electroless Ni-Pd-Au plating. 【Disadvantages of Electroless Plating】 - Cannot achieve thick film deposition. - Material loss occurs due to liquid renewal. - Long processing time leads to poor productivity. - There are limitations on the specifications of the electroless Ni substrate. ↓ ↓ ↓ 【Electrolytic Plating】 - Processing is possible regardless of film thickness. - Low material loss results in lower running costs. - Short processing time allows for improved productivity and reduced processing costs. - No restrictions on the substrate, allowing for options beyond Ni. 【Features】 - Electrolytic Ni: No restrictions on film thickness; can accommodate non-magnetic purposes even with a Cu substrate. - Electrolytic Pd: Film thickness can be adjusted according to specifications; prevents diffusion of the underlying Ni layer due to heat resistance (barrier layer). - Electrolytic Au: No restrictions on film thickness; good WB properties and solder joint reliability; suitable for semiconductor components.
A non-gold-plated section (nickel-plated exposed section) is provided, and the thickness of the gold-plated section can be adjusted vertically! Additionally, technical documentation regarding surface treatment is also available!
"Hoop Au plating" is a plating method suitable for connector components that connect electronic circuits. It realizes advanced technology that applies a "nickel barrier" to prevent solder wicking during assembly. When looking inside mobile phones and smartphones, ultra-low-profile narrow-pitch connectors are used, and these connector terminals are partially gold-plated. 【Features】 ■ In the partial plating reel-to-reel line, stripe Au plating and spot Au plating are possible. ■ Sn plating and Sn reflow are also possible for soldering areas. ■ Our unique special drum and inline laser stripping enable precise partial plating. ■ In the full plating reel-to-reel line, finishing Sn plating is performed, and it supports both underlying Ni plating and underlying Cu plating. ■ Reflow processing is possible for both underlying specifications, and it is compatible with SUS materials. * For more details, please refer to the PDF materials or feel free to contact us.
